硬件热工程师

Engage with the Hardware Design team to ensure proper thermal kit design from component to system and with the Data Center Operations team to ensure smooth product deployment

Develop and execute test plans to measure thermal performance/efficiency of hardware and thermal technologies. Quantitatively simulate and analyze hardware cooling schemes

Design and investigate cutting-edge thermal cooling solutions for advanced hardware systems for large scale deployment. Balance trade offs between design, cost, power and other critical parameters

Create analytical and numerical models using various Computational Fluid Dynamics tools or relevant simulation tools to describe system thermodynamics and heat transfer

Engage and lead external vendors including ODM and component vendors on design, test and production

Develop and publish case studies/technical papers describing thermal analysis of cooling systems and technologies

Establish the parameters for thermal design/testing, and correlation of the design/test results in order to model predictions

B.S. in Mechanical Engineering and/or with 6+ years relevant experience in thermal design related to server/hardware or advanced packaging

Experienced with computational thermal simulation software, such as Flotherm/Future Facilities/Icepak used for optimizing hardware cooling design

Experience using lab equipment such as data acquisition systems, air flow chambers, and environmental chambers for thermal validation and troubleshooting

Experience in designing and optimizing thermal cooling solutions, such as custom-made heat sink designs, and/or fan speed control algorithms

Experience to interpret/create mechanical system schematics by using 3D Computer-Aided Design (CAD) tool

Experience to create mathematical, computational and numerical models of industrial cooling systems, using MATLAB or comparable tools

Experience in Unix / Linux environment and/or familiarity with scripting and coding in python

Familiarity with design and optimization of control systems for components such as fans or pumps

Familiarity with custom thermal solutions including heat sinks, cold plates, and Thermal Interface Materials (TIM) materials for use in hardware systems

Experience in manufacturing processes such as Design for Manufacturability (DFM) and Design for Assembly (DFA)

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B.S.

in Mechanical Engineering and/or with 6+ years relevant experience in thermal design related to server/hardware or advanced packaging.

Experienced with computational thermal simulation software, such as Flotherm/Future Facilities/Icepak used for optimizing hardware cooling design.