基本要求：
- Experience communicating with customers, technical, regulatory, business teams, and management to collect requirements, describe product features, and technical designs
- Master's degree in mechanical engineering or equivalent
- 3+ years industry experience in advanced packaging of semiconductors
- Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials
- Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals
- 5+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design
- Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization
- Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software
优先条件：
- Experience in advanced packaging metrologies for characterization, and design validation of semiconductor components, packages, and platforms.
Hands-on experience with lab-based thermal and mechanical measurements, including instrumentation, infrared thermography, acoustic chambers, mechanical stress/strain gauges, power measurement equipment, and thermal test setups for package and system-level characterization.
- Strong understanding of product development lifecycles from concept through high volume manufacturing
- Experience with various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies - including cold plate design.
Working knowledge on fans, UQDs, manifolds, and CDUs.
- Developed detailed CFD and compact RC models for SoC and Package thermal analysis. Experience correlating simulation models with experimental data and iterating designs based on empirical findings.
- Demonstrated ability to design, set up, and execute experiments in a lab environment, including building custom test fixtures, operating data acquisition systems, and performing root-cause failure analysis on hardware.
Experience with Design of Experiments (DOE) and Six Sigma methodologies.
- Knowledge of hardware and software based thermal / power management control algorithms
- Validated thermal models through power/thermal measurements on Hardware
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Los Angeles Countyapplicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff;
adhere to standards of excellence despite stressful conditions;
communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service;
and follow all federal, state, and local laws and Company policies.
Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position.
These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation.
Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.
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